January of 1998, Surface Engineering moved into a brand new 18,000
square foot building, which includes an 1,800 square foot clean
area (class 10,000) for ultrasonic cleaning, assembly and inspection.
The whole facility is temperature controlled with the goal of +/-
1° F in the central grinding and assembly areas.
at Surface Engineering, armed with state of the art design and inspection
tools, work actively with the customer in designing and manufacturing
customer specific applications.
Engineering currently manufactures, on a production basis, several
in-house designed custom spindles for the wafer processing and wafer
Engineering is a supplier of precision parts and assemblies. We
produce extremely high quality parts in quantity or small lot sizes.
Process Capabilities have been established for the machinery and
Inspection, and SPC is used extensively in the facility.