In January of 1998, Surface Engineering moved into a brand new 18,000 square foot building, which includes an 1,800 square foot clean area (class 10,000) for ultrasonic cleaning, assembly and inspection. The whole facility is temperature controlled with the goal of +/- 1° F in the central grinding and assembly areas.

Engineers at Surface Engineering, armed with state of the art design and inspection tools, work actively with the customer in designing and manufacturing customer specific applications.

Surface Engineering currently manufactures, on a production basis, several in-house designed custom spindles for the wafer processing and wafer inspection areas.

Surface Engineering is a supplier of precision parts and assemblies. We produce extremely high quality parts in quantity or small lot sizes. Statistical Process Capabilities have been established for the machinery and Inspection, and SPC is used extensively in the facility.